pad properties explained

I want to verify my understanding about pad properties. I don't clearly know what it means (is it same with IPC explanation?). Please look at the drawing attached.

https://docs.google.com/open?id=0B1qP9mFCh0UBbmc0WEtDZmJ5SlE

also, I think thermal spoke should go into local components properties or even local pad. Since this affect amount of transferred current which may differ from pad to pad.